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摘要聚酰亚胺是一种具有重要应用价值的高分子材料。由于它具有优异的性能，因而二十多年来在品种、产量及应用范围等方面都得到了迅速发展。聚酰亚胺以均苯型为主，但均苯型聚酰亚胺在一些强度要求高、耐化学性要求高的特殊场合不能满足要求。而联苯型聚酰亚胺可望提高这些性能，因而近来受到人们的重视。本文以二氨基二苯醚（ODA）和均苯四羧酸二酐（PMDA）为单体在N-甲基吡咯烷酮（NMP）中合成了聚酰胺酸（PAA），又用不同比例的二氨基二苯醚（ODA）和对苯二胺（PDA）与联苯四羧酸二酐（BPDA）在N-甲基吡咯烷酮（NMP）中合成了6种聚酰胺酸（PAA），再经过去溶剂和亚胺化，最终得到了不同结构的聚酰亚胺（PI）。使用红外光谱(FTIR)、热失重分析(TG)和万能电子拉伸机研究了PI薄膜耐化学性能、力学性能以及热性能，并将均苯型和联苯型PI薄膜进行对比。结果表明，联苯型PI比均苯型PI有更好的耐化学性能和更大的拉伸强度，以及更高的热分解温度。且薄膜的拉伸强度和分解温度随原料中PDA含量的增加而增大。59861
毕业论文关键词 聚酰亚胺 联苯型 力学性能 热稳定性
Title Preparation and properties of biphenyl polyimide materials
Abstract Polyimide is a kind of polymer material which has important application value. Because of its excellent performance，polyimide has been developed rapidly in the terms of varieties, yield and range of applications during the past twenty years . The polyimide is based on polypyromellitimide, but polypyromellitimide can't meet the requirements in some special occasions when high strength and chemical resistance are required. Biphenyl polyimide is expected to improve the processing performance of polyimide, thus more and more people lay stress on it. In this paper, a kind of polyamic acid was prepared by diaminodiphenyl ether（DOA）and pyromellitic dianhydride（PMDA）in N-methyl-pyrrolidone（NMP）.In addition, six kinds of polyamic acids synthesized from pyromellitic dianhydride（BPDA）and different ratios of diaminodiphenyl ether（DOA）and P-Phenylenediamine(PDA) in NMP. After the desolvation and amination, polyamic acids were turned into the polyimides of different structure. The paper also has used infrared spectroscopy (FTIR), thermal gravimetric analysis (TG) and electronic universal tensile machine to research the chemical resistance, mechanical properties and thermal properties of the PI films, and compared benzene and biphenyl PI films. The results showed that biphenyl PI has better chemical resistance, better tensile strength and higher decomposition temperature than polypyromellitimide. The tensile strength and the decomposition temperature increased with the increasing proportion of the PDA in raw material.
Keywords Polyimide biphenyl polyimide strength properties thermal properties
毕业设计说明书（论文）外文摘要
1 引言 1
1.1 聚酰亚胺的发展史 2
1.2 聚酰亚胺的性质 3
1.3 聚酰亚胺的合成 4
1.4 聚酰亚胺的应用 5
2 实验部分 8
2.1 实验原料及仪器 8
2.2实验内容 9
3 结果与讨论 12
3.1 PI的合成路线 12
3.2 PAA和PI薄膜的红外光谱图