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摘要本文选取ODPA、PDA、ODA为原料，按照二胺的不同摩尔比合成了一系列ODPA-PDA-ODA型PI前躯体聚酰亚胺前体聚酰胺酸（PAA）,再通过热亚胺化制备PI薄膜。在铜箔上涂覆PAA，经过热亚胺化制得聚酰亚胺挠性覆铜板单面板及双面板。通过红外光谱(FTIR)、热失重分析(TG)等测试方法研究了聚酰胺酸的结构、热性能及其在两层挠性覆铜板(FCCL)上的剥离强度、尺寸稳定性等性能。59781
结果表明：1.涂布法单面板的剥离强度随PDA与ODA的摩尔比的增加而下降。只含ODA时剥离强度最大，为1.72kgf/cm。
2.涂布法双面板在230℃及250℃条件压合处理后测试结果，符合工业标准。
3. PAA热分解温度超过530℃，可在高温下使用。
毕业论文关键词：聚酰亚胺 挠性覆铜板 热固性聚酰亚胺
毕业设计论文外文摘要
Title Preparation of polyimide for the two layer flexible Copper clad laminate
Abstract
A series of ODPA-PDA-ODA co-polyamide acids with different composition were prepared in this paper. Preparation of PI film by thermal imine chemical.PAA was coated on the copper foil, was be made of thermal polyimide flexible copper clad panel and double panel. By infrared spectroscopy (FTIR), thermal gravity analysis (TG), such as polyamide acid was studied and the structure of polyimide film,thermal properties, solubility, mechanical properties and its application in flexible copper clad (FCCL) on performance of peel strength, dimensional stability, etc.
The results showed that:1. Peel strength of the single panel with PDA coating method: the increase of the molar ratio of ODA. The peel strength maximum 1.72 Kgf/cm When ODA containing only the maximum peel strength.
2. Double panel coated method under the condition of 230 ℃ and 250 ℃ by testing, comply with industry standards.
3. PAA pyrolysis temperature over 530 ℃, can be used at high temperatures
Keywords: Polyimide Flexible copper clad laminate Thermosetting polyimide
1 绪论 1
1.1 聚酰亚胺概述 1
1.1.1聚酰亚胺简介 1
1.1.2 聚酰亚胺性质 2
1.1.3 聚酰亚胺的分类及相关特点 2
1.1.4 聚酰亚胺的合成方法 5
1.1.5 聚酰亚胺的应用 7
1.2 挠性覆铜板简介 8
1.2.1 挠性覆铜板的概述 8
1.2.2 挠性覆铜板的分类及其特点 9
1.3 聚酰亚胺在FCCL中应用的发展趋势 9
1.4 本课题的主要目标及研究内容 10
2 实验部分 11
2.1 实验原料及仪器 11
2.2 实验内容 12
2.2.1 PAA的制备 12
2.2.2 涂布法PI单面板挠性覆铜板的制备 12
2.2.3 双面挠性覆铜板的制备 13
2.2.4 制备PAA薄膜 13
2.3 性能测试 13
2.3.1 红外光谱的分析（FTIR） 13
2.3.2 涂布法单面挠性覆铜板剥离强度测试