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摘要：本文利用在传统的电镀锡溶液中加入少量的锑盐，改变锑盐浓度，电镀时间，电流时间等参数研究锑对镀锡层的影响。镀锡及其合金是一种可焊性良好并具有一定的耐蚀能力的镀层，在电子元件，印刷线路板中广泛应用，锡层的制备除热浸、喷涂等物理法外，电镀、浸镀及化学镀等方法因简单易行已在工业上广泛应用。主要可用于制造锡罐，电器及电子工业，在铜线上起绝缘作用，也可作固体润滑剂。镀锡的种类主要有酸性镀锡，碱性镀锡和连续高速镀锡。在现行镀锡工艺中，常加入微量锑以提高镀锡层的某些性质。随着银价格的不断上涨，很多厂商的生产成本已经不足以支撑采用银作为表面镀层这一工艺，因此需要寻找其他的替代品，实验表明，采用镀锡和锡合金的防护效果与镀银层的效果不存在明显区别，均可以符合国家标准，并且可以节约成本，获得更好的经济效益，因此这种新的工艺是可行的。4931
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关键词：镀锡，锡锑合金，光亮性
Study the influence of trace antimony in tin plating layer
Abstract: Based on traditional antimony tin plating solution to add a small amount of salt, antimony salt concentration change, the electroplating time and current parameters such as time to study the effect of antimony on tin coating. Tin and its alloy is a kind of good solderability and have certain ability of corrosion resistant coating, in electronic components, printed circuit boards are widely used in preparation of tin layer in addition to the physical method such as hot dip, spray, electroplating and chemical plating, dip coating method for simple has been widely used in industry. Can be mainly used in the manufacture of tin cans, electrical and electronic industry, on the copper wire insulation effect, can also be used as a solid lubricant. Tin plating types mainly include acid tin, alkaline tin plating and continuous high-speed tin plating. In the current tin plating process, often join some properties of trace antimony in order to improve the tin plating layer. As the silver price is rising, the cost of production of a lot of manufacturers are not supported with silver as a surface finishes the process, so you need to look for other alternatives, and the experimental results show that adopting protective effect of tin and tin alloy with silver coating, the effect is not obvious difference between both can meet the national standards, and can save cost and get better economic benefit, so this new process is feasible.
Key words: Tin, tin antimony alloy, light
目录
1 引言 1
1.1锡的电镀.2
1.1.1镀锡层的性质..2
1.1.2锡的电镀工艺..3
1.1.3镀锡的装饰性应用..4
1.2电镀锡合金5
1.2.1锡铅合金.5
1.2.2锡锌合金.6
1.2.3锡银合金.7
1.2.4锡铋合金.8
1.2.5锡锑合金 8
1.3本课题的研究内容及研究意义..9
1.3.1研究内容.9
1.3.2研究意义.9
2 实验部分11
2.1实验试剂与设备11
2.1.1实验试剂11
2.1.2实验设备11
2.2实验材料及装置12
2.2.1实验材料..12
2.2.2实验装置..12
2.3工艺流程12
2.3.1铜片前处理.12
2.3.2电镀液的组成13
2.3.3电镀溶液配制13
2.3.4电镀流程..13
2.4工艺条件的选择13
2.4.1镀层工艺条件的选择13
2.5实验内容14
2.5.1镀层外观测定14
2.5.2镀层厚度测定14
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