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摘要：当前，在市场经济全球化的推动下，我国电子、电器产品正不断向尖端微型化方向迅速发展，同时对电子材料性能也提出了更高的要求。印刷线路作为电子产品的重要组成部分，作为用于制造印刷线路的铜箔质量也提出了新的要求。为了提高铜箔与有机材料间的结合强度，常采用表面粗化工艺。本次试验采用酸性硫酸盐镀铜工艺对铜箔表面进行粗化处理，粗化后的铜箔与CMC粘结剂结合，通过划痕测试和扫描电镜测试，分别对比不同粗糙度和不同CMC粘结剂浓度的测试结果，得出结论：增加基体表面粗糙度能有效提升基体与粘结剂的结合力，浓度高的CMC膜层与基底的结合力较优于浓度低的。以涂100μm膜厚1%CMC铜箔为例，未经粗化铜箔基底出现破裂时间为43.079s，而经粗化后的铜箔时间提高到了48.872s，延长了13.45%；以涂以膜厚均为100μm的1%CMC和5%CMC的经粗化后铜箔为例，涂以1%CMC的铜箔基底出现破裂时间为48.872s，而涂以5%CMC的铜箔基底时提高到了63.170s，延长了29.26%。20731
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毕业论文关键词：铜箔；酸性硫酸盐镀铜；粘结剂；扫描电镜；划痕测试。
The study of modification technology of electrolytic copper foil’s surface plating copper
Abstract: At present, driven by the globalization of the market economy, China's electronic and electrical products to sophisticated miniaturization direction is developing rapidly. What’s more, the requirements of electronic material performance are also increasing. Because of printed circuit as an important part of electronic products, the quality of the copper foil used in manufacturing printed circuit also puts forward the new requirements. In order to improve the bonding strength between the copper foil and organic materials, the surface roughening process is often used. Roughened copper foil are combined with adhesive. By the scratch testand scanning electron microscopy(SEM) test, compared with different roughness and different CMC concentration of the binder, we can draw the conclusion that increasing the roughness of the substrate surface can effectively enhance the adhesion strength of the substrate and adhesive. What ’s more, the higher CMC concentration is ,the better the binding force is. For example, when the coating thickness is 100μm, the time to rupture for unroughened copper foil is 43.079s, and the roughened one is 48.872s, improving 13.45%. When the coating thickness is 100μm, roughened copper foil are combined with CMC of 1% and 5% , the time to rupture for CMC of 1% is 48.872s, and the time to rupture for CMC of 5% is 63.170s, improving 29.26%.
Keywords: Copper foil; Acidic sulfate copper plating; Adhesive; The scratch test; Electron microscopy.
目录
1 绪论 1
1.1 研究背景 1
1.1.1 铜箔生产技术综述 1
1.1.2 铜箔的发展方向 3
1.2 电解铜粗化层处理 4
1.3 电镀铜技术 4
1.3.1 传统电镀铜技术 4
1.3.2 电镀铜先进技术 5
1.4 粘结剂的概念 7
1.4.1 粘结剂的应用及发展 7
1.4.2 粘结理论 7
1.4.3 CMC的特性 8
1.4.4 CMC胶液的配制 9
1.5 研究的目的和意义 9
2 实验内容 11
2.1 电镀铜镀液的选择 11
2.1.1 酸性硫酸盐电镀铜镀液组成及各成分作用 11
2.1.2 酸性硫酸盐电镀铜反应机理 11
2.2 实验所用工艺流程及规范 12
2.2.1 前处理工艺 12
2.2.2 粗化、固化处理工艺 13
2.3 试剂与仪器 13
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