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[摘要]：本篇毕业设计目的在于焊球超声波探伤测试。其主要任务是先要了解焊球制造的流程以及焊接缺陷的原因，并在此基础之上，掌握超声波的技术如何在焊球探伤检查中运用的，从而对焊球缺陷进行有效检测。39970
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对于芯片的应用有很多种，其中有一种为倒装。倒装芯片是一种主流的封装技术。它有很多优点，比如说，信号传播速度快，寄生电容小等等。倒装芯片给封装产业带来了春天。因为倒装芯片中的焊球存在缺陷从而给倒装芯片造成了一定的影响，本文使用超声波检测技术对倒装芯片进行检测，主要分析了焊球缺陷的原因以及超声波检测的原理。在现代工业生产中超声无损检测是运用的非常广泛的一种检测方法，对此本文进行了深入的研究，并简单的说明了超声波无损检测技术的研究作用与发展情况,超声波无损检测技术是目前非常先进的一种技术,应用领域较广,适用范围较大。
对于焊球缺陷图像的处理，我们需要做以下几项工作：对图像进行预处理、图像的分割以及图像的特征提取，其中我们要利用到matlab软件进行执行，最后再对实验结果进行分析。其中还主要介绍了Glasner算法，它主要是将基于重构法与基于学习法相结合形成的一种新的算法，因此可以对SAM图像进行高分辨率重构。然后对图像进行特征提取，主要应用平均灰度值作为判断依据对焊球缺陷进行了有效的检测。
[毕业论文关键词]：焊球、倒装芯片、超声波探伤 、特征提取
Using SAM Signal Reconstruction for Defect Inspection of Solder Bump
[Abstract]:This graduation balls aimed at the weld ultrasonic flaw detection test. Its main task is to first understand the reasons for balls manufacturing processes and weld defects, and on this basis, to grasp how to use ultrasound technology in the testing and inspection of the solder balls, which then come series of weld repair methods.
For chip applications it can be pided into two kinds, one for another flip-dress. Flip-chip is the chip down dress. This has many benefits, such as high efficiency, energy saving, high stability and so on. Flip-chip packaging industry to bring the spring. The third chapter explained the reasons for and the application of ultrasonic testing of solder defects. In modern industrial production, the use of ultrasonic nondestructive testing is widely used as a detection method, improve product quality and reliability it has an important role. First Wave NDT techniques for in-depth study of this article, and a brief description of the ultrasonic nondestructive testing technology research and development role, ultrasonic nondestructive testing technology is very advanced kind of technology, applications wider scope wider .
For solder defect image processing, we need to do the following tasks: pre-processing the image feature extraction, image segmentation and image, in which we have to use the matlab software for execution, and finally the experimental results were analyzed. The final chapter is to introduce the Glasner algorithm, which is based primarily on reconstruction of a new algorithm based on learning the Combination and the formation of its birth, to promote the development of society.
[Key Words]: solder bumps, flip-chip, ultrasonic detection, feature extraction
目录
摘要
Abstract
1.绪论.1
1.1选题的背景及意义.1
1.2 超声检测技术的发展历程和现状.1
1.3倒装芯片的简介与发展历程和前景.3
1.4倒装芯片的优点.3
1.5倒装芯片的键合技术.4
2.超声波检测的原理.6
2.1超声波的原理及分类.6
2.1.1超声波探伤的原理6
2.1.2超声波探伤方法及分类7
2.2超声波对倒装芯片的检测.7
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