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摘要近年来随着电子产品的轻薄化，印刷线路板也越来越向小型化、高密度化发展，因而其处理与生产工艺也越来越复杂化。以往的铜表面处理方法为热风整平法，但因含铅污染而逐渐被有机保焊剂取代。有机保焊剂具有成本低廉，操作简单，环境友好，符合无铅化时代的要求等优点。而有机保焊剂的水溶性与耐热性是其衡量其实用性与有效性的重要性能，水溶性决定其是否需要有机溶剂，溶剂是否会带来污染，耐热性决定了其在无铅焊接过程中能承受的加热温度。
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本毕业论文对苯并咪唑在水、冰乙酸及乙酸溶液中的溶解度进行了测定,采用了热重分析法与差示扫描量热法测定了苯并咪唑与苯并咪唑-铜离子络合物的耐热性，了解其分解温度。并使用了红外光谱法测定了苯并咪唑-铜络合物的结构。结果发现苯并咪唑的最优溶剂为浓度为乙酸溶液，其在铜面形成的络合物的分解温度约200℃，无法承受多次高温焊接。19046
关键词：有机保焊剂 水溶性 OSP 苯并咪唑 无铅焊接
毕业设计说明书（论文）外文摘要
Title Study of heat resistance antioxidant for fine copper material
Abstract
In recent years,along with electronic products getting lighter and thinner,printed circuit boards are increasingly to small,high-density development,and thus its processing and production technology has become increasingly complex.Conventional copper surface treatment method is hot air solder leveling,but HASL is gradually replacedby organic solderability preservative due to lead-free soldering.OSP has a low cost,simple operation, is environmentally friendly,meet the requirements of the lead-free age.The OSP’s solubility and heat resistance are important measure of its performance of its practicality and effectiveness.Solubility determines whether organic solvent is need,and whether it will bring pollution.Heat resistance determines whether it is able to withstand the temperature during lead-free soldering.
In this paper,we measured benzimidazole’s solubility in water, aetic acid and acetic acid solution.We analysis benzimidazole and benzimidazole-copper’s heat resistance by thermogravimetry and differential scanning calorimetry.We also measured benzimidazole-copper complex’s structure by using infrared spectroscopy.The results showed that the best organic solvent is acetic acid solution,the decomposition temperature of benzimidazole-copper’s complex is about 200℃, unable to withstand several high-temperature soldering.
Keywords OSP solubility Benzimidazole lead-free soldering
目 次
1 绪论 1
1.1 课题背景 1
1.2 印刷线路板的常见表面处理方式 1
1.2.1 热风整平 1
1.2.2 浸银 2
1.2.3 化镍浸金 2
1.2.4 浸锡 2
1.2.5 有机保焊剂 3
1.3 有机保焊剂的发展 3
1.3.1 苯并三氮唑Benzotriazole（BTA）类，第一代 4
1.3.2 烷基咪唑Alkylimidazole（IA）类，第二代 5
1.3.3 苯并咪唑Benzimidazole（BIA）类，第三代 5
1.3.4 烷基苯并咪唑Substituted Benzimidazole（SBA）类，第四代 5
1.3.5 烷基芳基咪唑Aryl Phenylimidazole（API）类，第五代 5
1.4 本课题的研究内容 6
2 有机保焊剂的成膜机理 7
3 实验内容与结果分析 11
3.1 有机保焊剂溶液组成与处理工艺 11
3.1.1 有机保焊剂溶液的一般组成 11
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