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摘要聚酰亚胺( PI )是指主链上含有酰亚胺环的一类化合物，通常这类材料具有良好的机械、绝缘、耐辐射、耐腐蚀和耐高低温等优良性能，广泛用于印刷电路材料、航天军事等领域。近年来，PI制两层挠性覆铜板用聚酰亚胺材料的制备引起了业界的广泛兴趣。
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本次实验选取BPDA、BTDA作为二酐原料、p-PDA和ODA作为二胺原料，先合成聚酰亚胺的前驱体聚酰胺酸（PAA），再经过在烘箱、马弗炉里一系列的亚胺化处理得到最终产物聚酰亚胺。然后，采用红外图谱、TG曲线、拉力曲线对聚酰亚胺进行了结构、热性能和力学性能的分析。此外，还研究了聚酰亚胺的溶解性能。
本实验结果表明：以不同二酐和二胺比例制备的PI性能不同。合成的PI在氮气中¬¬¬¬¬¬起始分解温度均超过530℃，玻璃化温度均低于300 ℃，显示出了良好的热塑性，拉伸强度可高达100.62MPa，用PI所制备的2L-FCCL的剥离强度较高。具有一定的工业应用价值。6131
关键词 聚酰亚胺 制备 两层挠性覆铜板 性能
毕业设计说明书（论文）外文摘要
Title Preparation of polyimide of two layers of flexible Copper clad laminate
Abstract
The polyimide (PI) is a class of compounds containing the imide ring in the main chain，and Such materials usually have the excellent performance of good mechanical, insulation, radiation-resistant, corrosion resistance and high temperature resistance, which are widely used for printed circuit materials, aerospace and military fields. In recent years, the polyimide materials used for two layers of flexible copper clad laminate has aroused wide interest in the industry.
We selected BPDA, BTDA, p-PDA and ODA as raw materials, and synthesized a series of BPDA-BTDA-p-PDA-ODA precursor(PAA) of PI with different ratio of dianhydride and diamine. Finally, TPI film and PI flexible copper clad laminate was prepared by conventional thermal imidization. In this research experiment ,infrared spectroscopy (FTIR)，thermal gravimetric analysis (TG)，universal electronic tensile machine，and dissolution testing were used to characterize the structure of the polyamic acid ， the thermal properties，mechanical properties，solubility of PI film and the peel strength，dimensional stability of the two layers of flexible copper clad laminate (2L-FCCL).
The experimental results show that the performance of the PI ranges with the ratio of the dianhydride and diamine. PI has a good thermal stability, the initial decomposition temperature of more than 530 ° C in nitrogen, the glass transition temperature of less than 300 °C, which showed good thermoplastic, 2L-FCCL peel strength up to 1.70kgf/cm, which shows the industrial value.
Keywords Polyimide; Preparation; Two layers of flexible copper clad laminate; performance
目次
1 引言 1
1.1 用聚酰亚胺材料制备的两层挠性覆铜板的发展前景 1
1.2 聚酰亚胺的合成 4
1.2.1 原料及合成途径的选择 4
1.2.2 聚酰胺酸（PAA）溶液的合成 4
1.2.3 聚酰胺酸的亚胺化 4
1.3 聚酰亚胺的应用 4
1.4 影响薄膜性能的因素 5
1.5 聚酰亚胺覆铜板的胶接机理 6
2 实验部分 7
2.1 实验原料及仪器 7
2.2 实验内容 8
2.2.1 PI的制备 8
2.2.2 PI柔性覆铜板的制备 9
2.3 性能测试 9
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