摘要本课题在对导电高分子导电原理以及导电掺杂处理方式深刻了解的基础上,采用原位聚合的方法在电路板微孔中对吡咯单体进行氧化聚合,得到厚度均匀、导电性良好的聚吡咯薄膜,完成微孔的导电化处理。在聚吡咯的聚合反应中设计出较为完善的聚合方案,对于粗化液、单体溶液、聚合溶液等采用逐步操作的方法完成聚合过程,得到黑色聚吡咯膜。此次实验中聚合方式为原位聚合,即掺杂剂与单体聚合的过程相结合,使掺杂剂直接添加进入反应体系,而不是在聚合完成之后进行掺杂。对合成出的聚吡咯薄膜的分子结构、表面形态、与基板的结合力大小等相关性质进行测定,验证实验方案是否可行。最后得出本课题导电高分子薄膜原位聚合设计过程的方案。43299
关键词 导电高分子 原位聚合法 聚吡咯 氧化性掺杂 质子酸掺杂
毕业论文设计说明书外文摘要
Title Conductive Polymer Film In Situ Polymerization
Abstract
This subject conductive polymer and conductive principle conductivity doping treatment on the basis of deep understanding, in-situ polymerization in the pores of the board of oxidative polymerization of pyrrole monomer to obtain a uniform thickness, good conductivity of poly pyrrole film, completed conductive process micropores. In the polymerization of polypyrrole to design more comprehensive aggregation scheme for roughening liquid monomer solution, a solution polymerization method such as the use of the polymerization process is completed step by step, to obtain a black polypyrrole film. The polymerization experiments in situ polymerization mode, i.e., during the polymerization of the monomer dopants combined dopant is added directly into the reaction system, rather than after completion of the polymerization doping. The molecular structure of the synthesized polypyrrole films, surface morphology, and size-related properties of the substrate binding was measured to verify the feasibility of the experimental program. The issue came to the conclusion conducting polymer film in-situ polymerization process design scheme.
Keywords Conducting polyme In situ polymerization polypyrrole Oxide doping
目 次
摘 要 I
Abstract II
目 次 III
1 绪论 1
1.1 引言 1
1.2 导电高分子及电路板微孔导电化研究状况 1
1.2.1导电聚合物的分类 1
1.3电路板孔导电化技术 2
1.3.1 导电聚合物法 2
2 聚电薄膜原位聚合方法 3
2.1 吡咯单体性质 3
2.2 聚吡咯结构与性质 3
2.3聚吡咯合成方法 3
2.3.1化学氧化法 4
2.3.2电化学聚合法 4
2.3.3模板法 4
2.4聚吡咯掺杂机理 4
2.4.1质子酸掺杂 4
2.4.2氧化型掺杂 4
2.5聚吡咯原位聚合 5
2.5.1化学气相沉积聚合法 5
2.5.2直接聚合法